The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various ...

North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that ...

BE Semiconductor Industries (Besi) , a supplier of advanced packaging tools for chipmakers, said on Wednesday its order ...

Harris Khan Niazi from Intel speaks with DCD's Charlotte Trueman about advanced packaging in silicon assembly to meet AI ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

(Reuters) - Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer chip ...

TSMC made clear this week that it has big plans for Fab 21, its Arizona chip manufacturing campus. In an earnings call, TSMC ...

Element Solutions Inc (ESI) reports strong Q1 2025 with 10% electronics growth, robust demand in AI and data centers, and a strengthened balance sheet.

Unlike most semiconductor packaging steps, hybrid bonding occurs much closer to the chip's production line and work together with Applied Materials' tools. "I think shareholders will be extremely ...